Qualcomm (QCOM) – Get Report promises its newest flagship processor will deliver substantial CPU, GPU, AI and camera performance gains relative to its predecessor, while also packing an integrated 5G modem and delivering superior power efficiency.
On Wednesday morning, a day after Qualcomm officially unveiled its Snapdragon 888 mobile system-on-chip (SoC), the company is sharing a host of technical details about the chip, which will succeed the Snapdragon 865/865 Plus as Qualcomm’s flagship processor and is expected to power a large percentage of the high-end Android phones that launch in 2021.
The Snapdragon 888’s Technical Specs
As rumored, the 888 is made using a 5-nanometer (5nm) Samsung manufacturing process that offers performance, power efficiency and transistor density improvements relative to the 7nm TSMC (TSM) – Get Report process used by the Snapdragon 865.
Also as expected, the 888 integrates Qualcomm’s next-gen, high-end 5G modem, the Snapdragon